07
Oct
2014

Solder Joint Integrity Test for Finding Latent Defects in PCBs

Solder Joint Integrity Test for Finding Latent Defects in PCBs  Published: 30 November - 2014  by Hiroshi Yamazaki   A novel method purports to locate defects that escape boundary scan and other tests. Several test methods have been developed to find solder joint defects in printed circuit...

Read More