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Key Features
- User-friendly touch panel operation
- Up to six heating zones offer flexible thermal control for lead-free soldering
- Powerful thermal capability utilizing top convection heaters of 1080W and bottom IR heaters of up to 3000W
- Instant profiling system using digital thermal feedback
- Highly-accurate visual alignment system
- Split mirror utilized for large BGA alignment
- Solder paste printing capability
| Equipment Size |
650mm(W) x 860mm(D) x 730mm(H) / 80Kg |
| Max.PCB size |
Standard -- 400mm(W)x300mm(D)
Optional --- 510mm(W)x400mm(D) |
| Max. component Height |
Top-45mm / Bottom-25mm |
| Max. component size for vision system |
50mmx50mm |
| Board thickness |
0.5-3.5mm / 3kg |
| Top convection heater |
1080W |
| Bottom IR heater |
Standard --1000W
Optional ---additional 2000W |
| PID control |
Yes |
| Touch panel operation |
Yes |
| Power 200 / 220 / 240V single phase |
Yes |
| Pneumatic requirement |
0.5Mpa |
| Placement accuracy |
±0.025mm |
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