Advanced Machinery for Electronics Manufacturers | SEIKA Machinery, Inc.

CKD 3D Solder Paste Inspection System

Key Features

  • 100% In-line inspection
  • Ultra-high Resolution
    -Horizontal: 18µm/12µm/8µm
    -Vertical: 3µm
  • High-speed inspection
    -23.5sq cm/sec. (3.7sq in/sec.) 18µm
    -10.6sq cm/sec. (1.7sq in/sec. ) 12µm
  • Inspection View: 28mm x 21mm (1.1" x 0.83")
  • Windows PC based
  • Control up to 6 SPI systems simultaneously with Data Station option!
  • Powerful SPC software and tools for absolute control over line process
  • User-friendly and intuitive operation
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