The Sawa 5000GUS removes solder balls from stencil apertures after normal wipe cleaning. A powerful hand held ultrasonic cleaning head (W4.61xD4.61xH3.94 in) is manually applied over apertures with IPA, water or a non-VOC solvent. During application of the cleaning head, the stencil is laid on a foam pad soaked with solvent contained within a large tray (32 in x 32 in). The foam is utilized to capture solder balls dislodged by the cleaning head.
Key Features
The Sawa 5000GUS applies ultrasonic vibration directly to the stencil providing powerful cleaning capability.
The Sawa 5000GUS cleans apertures as effectively as fully automatic stencil cleaners that can cost three times as much.
Stencils can be cleaned in just a few minutes.
Specifications
Note: The specifications are subject to minor change for improvement of the product.