Sawa Ultrasonic Stencil Cleaners

Description

The Sawa 500GE removes solder balls from stencil apertures after normal wipe cleaning.  A small hand held ultrasonic cleaning head (2.36 in Diameter) is manually applied over apertures with IPA, water or a non-VOC solvent.  During application of the cleaning head, a small tray containing a foam pad soaked with solvent is held underneath the stencil to capture solder balls dislodged by the cleaning head.

Key Features

• The Sawa 500GE can clean stencils without removing them from the printing machine.
• Stencils can be cleaned in just a few minutes.
• Portable.