Key Features
- The Sawa 500HE can clean stencils without removing them from the printing machine.
- Stencils can be cleaned in just a few minutes.
- Portable.
The Sawa 500HE removes solder balls from stencil apertures after normal wipe cleaning. A small hand held ultrasonic cleaning head (2.36 in Diameter) is manually applied over apertures with IPA, water or a non-VOC solvent. During application of the cleaning head, a small tray containing a foam pad soaked with solvent is held underneath the stencil to capture solder balls dislodged by the cleaning head.
Specifications
| Generator: | W3.15 x D7.48 x H1.69 in 3 lbs approx |
|---|---|
| Transformer: | AC100~240V 50/60kHz 40W |
| Tray: | W10.63xD8.27xH1.18 in |
| Foam Pads: | 20 pcs |
| Vibration Frequency: | 40kHz |
Note: The specifications are subject to minor change for improvement of the product.
